One-component epoxy resin (Conductive)
Product | Appearance | Cure | Viscosity mPa.s (Cps) | Volume resistivity (Ω/cm3) | Shear force (psi) | Features and Benefits |
EC200LV | Silver gray paste | Heat120℃*30min | 10000~50000 | ≦2*10-3 | 500 | Solvent-free, No porosity when cured, good adhesion |
Applicable to the electronics industry.
Suitable for optoelectronics, general electronics and conductive products required by the industry.
Bonding of integrated circuits, bonding of LED chips, fixing of automobile motor diodes.
It is suitable for conductive coating and bonding of metal, ceramic and glass materials.
Solvent-free
No porosity when cured
High adhesion
Fast cure
High viscosity